Sapphire Wafers / Sapphire Substrates

Diameter: 2-8 inch depending on orientation
Orientation accuracy: +/- 0.1°
Off orientation possible
Thickness: down to 80 micron, depending on diameter
TTV: down to 2.5 micron, depending on diameter
Bow: down to 5 micron, depending on diameter
Roughness of Polished surface: down to 0.2 nm, depending on diameter
Lapped surface: Ra 0.4 micron
Laser marking: on request
Packaging: in Empak boxes, double bagged under vacuum

We are able to produce on request wafers to tighter specifications.