Quartz Wafers / Glass Wafers

For Mems Application. Wafers without internal defects (bubbles)

Dimensions: 50 - 200 mm
Standard thickness: 0.3 to 1 mm; other thickness on request
Single and double sides polished
TTV < 10 micron as standard,
TTV < 3 micron and TTV < 1 micron on request
Capacity > 10000/month
Standard execution
B 270 Schott highly transparent low-iron optical glass.
D 263 Schott low alkali Borosilicate glass highly resistant to chemical attack.
Tosoh ES Tosoh (Japan) High-purity Synthetic silica with virtually no bubbles or inclusions, excellent UV transmission characteristics.
Other materials on request.